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Company Description |
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RF Vacuum Plasma Processing is a dry, low temprature process for desmear and etch-back of Printed Circuit Boards, surface preperation of PTFE etching, cleaning, sterilisation and removal of organic contaminants, surface preperation, adhesion promotion, surface radicalisation and Surface Engineering of plastics and rubbers, and as a replacement of CFCs for cleaning and degreasing of metals and glasses etc.
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